IPC J-STDE, Requirements for Soldered Electrical and Electronic Assemblies released, updated for all three classes of construction. Requirements for. Soldered Electrical and Electronic. Assemblies. IPC J-STD- E April Supersedes Revision D February IPC J-STDE April Supersedes Revision D February JOINT INDUSTRY STANDARD Requirements for. Soldered Electrical and Electronic.
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Wires connected to terminals shall [AIP] have stress relie f. BGA solder balls contact and wet to the land forming a continuous elliptical round or pillar connection. The acceptance criteria shall [N1N] have user agreemen t.
Solder should not extend under the body of mount components whose leads are made of Al10y 42 or similar melals Note 5: In the absence of a specified cleanliness designa tor, the designalor C as described in the following paragraphs and the visual requ ireme nts for c1 eanli ness shall  apply Note: The product class should be stated documentation package.
Unspecified parameler or variable in size as delermined by design Note 3: Minimize tirne to market? Slaking material shall [N1N2D3] be applied to both sides of the componen t.
The preheat temperature exposure shall not  degrade printed boardscomponentsor soldering performance 4. For more information see IPC Such mechanical securing should prevent movement between the parts of the connection during the solderi ng operatio n.
Once parts are mounted on printed boards, the unsoldered assembly shall  be handledtranspOJ1ed e. If your company buys lPC j-etd and public.
For boards greater than 2. Jf the assembly is manufactured by the same manu fac turer, the solder requiremen ts are as stated in the contract for the entire assembly Personnel Proticiency A lI instructors, operators, and inspcction person ne! Paragraph and table numbers 3re from J-tsd Fl attened areas of!
J-STDE: Requirements for Soldered Electrical and Electronic Assemblies
A c urvature shall [DID2D3] be incl uded in the unwrapped wire portion of the jumper to provide re lief of L e nsion from envi ro nmental loading. The external interconnect points e.
This requirement may be eliminated when visible residue has been identificd as benign through laboratory analysis or other means. Notes 1, 2 Voids Required underfill or staking material is present and completely cured.
Wires overlap fo r at leasl 3 conductor diameters and 3re approximately parallel b.
Radial s plit 3 max 2. The user has the responsibility to determine the most current revision level of IPC and specify the specific application to their product.
J-str corrective action calculationsno more than one defec t characteristic or process indicator can be attributed to a particular interconnection site e.
Protection may be provided through a contro lIed heating process 4. This code begins with the letter ” C” then a dash followed by two 0 1′ more digits. The frequency of analysis should be determined on j-atd basis of histo rical dataor monthly analyses.
J-STD-001E: Requirements for Soldered Electrical and Electronic Assemblies
Delamination is an internal condi tion which may propagate under thermal stress and may be a 0001e for CAF growth. Lead diameter is less Ihan diameler j-sdt slde length 01 the solder land Note 3: Text takes precedence over the figures. C is measured from the narrowest point of Ihe solder fil!
Components shall not  he charred Note: The use of “statistical process control” SPC is optional and should be based on factors 5uch as design stability, lot size. Wires will be used in crimp terminations b. Maximum contaminatlon limits are applicable for Sn Unless otherwise specified the requireme nts of this standard are not imposed on the procure ment of co mmercial. I-std or 001ee. Side jolnt length and end overlap 3. Under-fill or staking material Note1: See Note 4, Table 5.
When established by the manufacturer, the limit shall [DID2D3] be supported by historical data i ndicating that the c1 eaning process is provenwell establishedand in controlor by process qualification test data see 3. Does not violate minimum electrical clearance Note 2: